Service

PCB Design & Layout

Boards engineered for signal integrity, manufacturability, and the smallest footprint your product can carry.

Definition

What is PCB design and layout?

PCB design and layout is the engineering of a printed circuit board — schematic capture, component placement, copper routing, stack-up, and generation of the fabrication files. We design multilayer, high-speed, and HDI boards with signal-integrity and design-for-manufacturing discipline, and release a complete file set a fabricator and assembler can build without a single follow-up question.

A design service, not a board broker

Search for "PCB design" and most results are fabrication houses that treat layout as a free add-on to win the board order. That is not what we do. We are electronics engineers who design boards — and we are paid for the engineering, with no incentive to steer you toward a particular fab.

That independence matters. We design to your fabricator's real capabilities, hand you native CAD files you own, and make placement and routing decisions based on how the circuit needs to behave — not on what is easiest to quote.

PCB

Where HDI earns its keep

When a product has to shrink — or a fine-pitch BGA simply leaves no room for ordinary vias — high-density interconnect design is what makes the board possible. Microvias, via-in-pad, and stacked vias let us escape dense packages, shorten high-speed nets, and pack more function into less area, often reducing both board size and layer count.

HDI is not the right answer for every board, and we will tell you when it is not. But when your product needs it, designing HDI well is the difference between a board that fits and one that does not.

Cross-section of a six-layer HDI PCB stack-upA BGA package sits on the top copper layer. A laser microvia in the BGA pad reaches layer two, a buried via connects layers two through five, and a plated through-hole via passes through all six copper layers.Fine-pitch BGA123L1 — signalprepregL2 — ground planecoreL3 — signalL4 — power planeL5 — signalL6 — signal≈ 1.6 mm1Laser microvia, via-in-pad (L1–L2)2Buried via (L2–L5)3Through-hole via (L1–L6)Cross-section of a 6-layer HDI stack-up — copper shown in amber, not to scale.
Comparison

PCB design vs PCB layout: what is the difference?

The two terms are often used interchangeably, but they describe different scopes. PCB design is the whole engineering effort — schematic, component selection, and electrical intent. PCB layout is the physical step within it: placing parts, routing copper, and generating the manufacturing files.

PCB designPCB layout
ScopeThe complete board-engineering effortThe physical-implementation step within design
Main activitiesSchematic capture, component selection, electrical decisionsPlacement, routing, copper pours, stack-up
Starts fromRequirements and circuit intentA finished schematic and netlist
ProducesA verified circuit and the intent behind itGerber/ODB++, drill, BOM, and assembly files
Key questionWill this circuit do the job?Will this physical board perform and build correctly?
Capabilities

Layout disciplines on every board

Schematic capture and netlist-driven layout
Multilayer rigid PCB design (we routinely work well beyond standard layer counts)
HDI design with microvias, blind/buried vias, and via-in-pad
High-speed routing — length matching, differential pairs, controlled impedance
Fine-pitch BGA, QFN, and 0201/01005 component layout
Power-integrity and thermal-aware placement and copper planning
Stack-up design and impedance calculation
EMC/EMI-conscious layout and grounding strategy
Design-rule checks (DRC) tuned to your fabricator's capabilities
Native files in Cadence OrCAD & Allegro, Siemens Xpedition, Altium, or KiCAD
Process

From schematic to fabrication release

  1. 01

    Schematic Review

    We start from your schematic — or capture one — and confirm netlist, footprints, and the electrical intent before any placement.

  2. 02

    Stack-up & Rules

    We define the layer stack-up, impedance targets, and design rules to match both the circuit and your chosen fabricator.

  3. 03

    Placement

    Components are placed for signal integrity, thermal performance, test access, and assembly — the decisions that make or break a layout.

  4. 04

    Route & Verify

    Controlled-impedance and length-matched routing, copper pours, then full DRC/ERC verification against the rule set.

  5. 05

    Release

    We generate and sanity-check the complete fabrication and assembly package, ready to build.

Deliverables

The release package

Gerber or ODB++ fabrication files
NC drill files and fabrication drawing with stack-up notes
Bill of materials (BOM) and centroid / pick-and-place files
Assembly drawings and the source schematic
Design-rule-check (DRC) and electrical-rule-check reports
Native CAD project files you can maintain yourself
Specifications

Board technology we work in

Layer countSingle-sided through high-layer-count multilayer
TechnologyRigid, HDI (microvia / stacked / buried)
Min. component0201 / 01005 passives, fine-pitch BGA
Signal integrityControlled impedance, differential pairs, length tuning
ToolsCadence OrCAD & Allegro (primary) · Siemens Xpedition · Altium Designer · KiCAD
OutputGerber / ODB++, drill, BOM, centroid, assembly drawings
Cost guide

How much does PCB design cost?

PCB design cost follows complexity — layer count, component density, and signal-integrity requirements drive most of it. The ranges below are typical for a layout iteration and exclude board fabrication and assembly.

Board complexityTypical design costWhat drives it
Simple 2-layer, low part count$500 – $2,000Few components, no high-speed nets
Multilayer (4–8 layers)$2,000 – $8,000More routing, power planes, moderate density
High-speed / controlled impedance$5,000 – $15,000Length matching, differential pairs, SI analysis
HDI / dense fine-pitch BGA$10,000 – $30,000+Microvias, via-in-pad, tight escape routing

Directional ranges per design iteration. We give a firm quote once we have reviewed the schematic and board requirements.

Often used in
IoT & Connected DevicesIndustrial & AutomationAerospace & Defense
FAQ

PCB Design & Layout FAQs

PCB design is the broader effort — it includes the schematic, component selection, and the electrical intent of the circuit. PCB layout is the step that turns that schematic into a physical board: placement, routing, copper pours, stack-up, and the Gerber and drill files. Every layout is part of a design, but design also covers the decisions made before any trace is drawn.

HDI (high-density interconnect) PCB design uses microvias, finer traces, and stacked or buried vias to pack more connections into less space. You need it when a board has to shrink, when fine-pitch BGAs leave no room for standard vias, or when high-speed signals demand shorter, cleaner routing. Applied well, HDI can cut board area substantially and reduce layer count.

A complete release package: Gerber or ODB++ fabrication files, NC drill files, a bill of materials (BOM), centroid/pick-and-place files, assembly drawings, the schematic, a design-rule-check (DRC) report, and a fabrication drawing with stack-up and impedance notes. It is everything a fabricator and assembler need — no missing pieces to chase.

We work in the industry-standard professional toolchains — including Cadence OrCAD & Allegro (primary), Siemens Xpedition, Altium Designer, and KiCAD — and match the tool to the project and to your existing design database when you have one. That means we can pick up an in-progress design or hand you native files you can maintain yourself.

PCB design is usually quoted by complexity — layer count, component count, density, and signal-integrity requirements — rather than a flat fee. A straightforward two- to four-layer board is a modest engineering cost; a dense, high-speed HDI board with controlled impedance is considerably more. We give a firm quote once we understand the schematic and board requirements.

Start your PCB Design & Layout project